AMD MI325X vs H200: Specs
Architecture, compute capability and supported precisions for the AMD MI325X and the H200, from vendor datasheets.
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Specs side by side
| Spec | AMD MI325X | H200 |
|---|---|---|
| VRAM | 256GB HBM3E | 141GB HBM3e |
| Memory bandwidth | 6 TB/s | 4.8 TB/s |
| Architecture | CDNA3 | Hopper |
| Compute capability | n/a | 9.0 |
| Precisions in hardware | FP32, FP16, BF16, FP8, INT4 | FP32, FP16, BF16, FP8, INT4 |
| Peak FP16/BF16 tensor TFLOPS | 1,307.4 TFLOPS | 989 TFLOPS |
| Peak FP8 tensor TFLOPS | 2,614.9 TFLOPS | 1,979 TFLOPS |
| NVLink / multi-GPU interconnect | Infinity Fabric, 8 links at 128 GB/s peak each | NVLink 4, 900 GB/s bidirectional |
| Max board power (TDP) | 1000W peak | Up to 700W (configurable) |
